GGB project engineer, Andreas Epli, will make a presentation on bearings for packaging machinery at the KEM Design Engineer Packaging Technology Conference, October 20, at the Packaging Excellence Center in Waiblingen, Germany near Stuttgart. The title of his presentation is “Slim, Compact and Maintenance-Free Plain Bearings.” Sponsored by KEM magazine, a leading German industrial trade publication, the conference will focus on high-tech components and systems. It will address the smart packaging system of the future, the role of designers in customized packaging, and available solutions in electrical and mechanical power transmission, hydraulics and pneumatics, identification technology, and sensor and control technology. The PEC serves as a regional competence center for packaging and automation technology. Interfacing with industry, the scientific community and government, it demonstrates the application potential of new technologies and supports their implementation, provides education and training, and facilitates access to funding. With over 60 members, it is the largest competence center for packaging in Europe.